Xilinx SP701 Evaluation Kit Programmable Logic IC Development Tool EK-S7-SP701-G

Xilinx SP701 Evaluation Kit Programmable Logic IC Development Tool EK-S7-SP701-G

$861.00Price

Xilinx SP701 Evaluation Kit Xilinx Programmable Logic IC Development Tools

 

P/N: EK-S7-SP701-G

 

Xilinx SP701 Evaluation Kit is built for designs requiring sensor fusion such as industrial networking, embedded vision, and automotive applications. The evaluation kit is based on the XC7S100FGGA676 device, a member of the Xilinx® 7 Field Programmable Gate Array (FPGA) line of products. The SP701 Evaluation Kit features high I/O availability and I/O expansion capability via Peripheral Module interface (Pmods) and FPGA Mezzanine Card (FMC) connectors, making it the largest IP development canvas for Spartan-7 FPGA users. The board is designed for high-performance and lower power with a 28nm, 1V core voltage process. For lower power, the board has a 0.9V core voltage option.

 

FEATURES

  • Connectivity for sensor heavy applications
  • Video interfaces, including MIPI CSI, DSI, and HDMI
  • Expandable I/O via Pmods and FPGA Mezzanine Card (FMC) interfaces
  • Dual ethernet for industrial networking
  • Best-in-class performance and flexibility with the largest Spartan-7 device
  • Built for connectivity with 400 available I/O pins
  • Scalable across the industry’s broadest cost-optimized portfolio
  • Easy-to-use soft processor options for embedded applications
  • Pre-configured MicroBlaze™ application processor, real-time processor, and microcontroller Example Designs with up to 200DMIPS of processing power
  • Arm® Cortex®-M1 and Cortex-M3 DesignStart FPGA available
  • Free Vivado® HL WebPACK™ Edition support
  • Includes Xilinx Software Development Kit (XSDK) for C compilation and debug
  • Customize designs quickly and easily with drag-and-drop peripherals

 

SPECIFICATIONS

  • XC7S100-2FGGA676 package
  • 152.4mm4 x 88.44mm
  • Configuration
    • Quad SPI (QSPI) 1Gb
    • Direct QSPI flash program header
    • USB-to-JTAG bridge
  • DDR3L SDRAM memory
    • 256Mx16 4Gb DDR3-1866
    • 32 Kb I2C EEPROM for hardware ID storage accessible by FPGA and system controller
  • Clocks
    • I2C programmable SYSCLK oscillator 33.33MHz
  • VITA 57.1 FMC-LPC connector
    • 34 differential pairs or 68 single-ended LA[00-33] bus
    • 2x 10/100/1000 Tri-Speed Ethernet PHY
  • Mobile industry processor interface (MIPI) features
    • MIPI-CSI Camera Serial Interface (for PCAM 5C from Digilent)
    • MIPI-DSI Display Serial Interface
    • HDMI output (1.4 specification support)
  • USB-UART interface
    • FT4232H JTAG/3xUART
    • System controller (MSP430)
    • +12VDC operating voltage
    • I2C Bus
    • 6x Pmod rt-angle receptacle (Digilent Pmod IF 1.2.0 specification support)
  • General purpose I/O (GPIO)
    • 8x LED (GPIO_LED[0:7]) (active-High)
    • 5x pushbutton switch, geographical, GPIO_SW_[N,E,S,W,C] (active-High)
    • 1x pushbutton switch, CPU_RESET (active-High)
    • 2x 8-pole DIP switch, GPIO_DIP_SW_B[0:15] (active-High)
  • Operational switches
    • Power on-off slide switch
    • PROG_B pushbutton switch (active-Low)
    • 4-pole configuration mode DIP switch M[0:2]_0_SW, INIT_B_0 (active-Low)
  • Operational status LEDs
    • Done
    • Power on
    • PG (Power good)
  • Power system
    • Vccint 0.90V or 1.00V (I2C selectable)
    • I2C telemetry on 12V input and Vccint
  • Environmental
    • Temperature
      • Operating: 0°C to +45°C
      • Storage: –25°C to +60°C
    • Humidity
      • 10% to 90% non-condensing